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Latest update: 20 July 2010

NEWS

In cooperation with Sempro Technology Sdn Bhd in Malaysia we are proud to inform you that we deliverd and installed a fully automatic screwing assembly machine at one of our worldwide located customer.
We thank our Customer for their trust in Sempro and we look forward to supply other Customers in the near future with our automation solutions.
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Please be informed that contact details from Sempro The Netherlands have been changed:
 
New Contact details: (only Sempro The Netherlands)
 
Sempro Technologies bv
Koningstraat 8, 6644 KK Ewijk
The Netherlands
Tel. +31 (0)487 -511863
Mob. +31 (0)6 - 2623 0270
Fax. +31 (0)487 -511689

Our contacts in Sempro office Malaysia:
 
Mr. HP Sim
Sempro Technology Sdn. Bhd.
Plot 87A, Lintang Bayan Lepas 9
Bayan Lepas FIZ Phase 4
Penang, Malaysia
Tel: +60-4-644 2235
Fax: +60-4-646 4044
Email: hpsim@sempro.nl
 
Frequently we will update and inform you on www.sempro.nl or via our e-newsletters.
 
Trust we have informed you accordingly. For any questions please let us know.
 
With kind regards, 
Mr. Ewald Peters
Sempro technologies BV

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Thanks to all customers

We thank you for visiting us at our booth at the Semicon China during 16-18 March in Shanghai.

For more information on any prodcuts or on the Advanced packaging Center (APC)

please do contact us on: info@sempro.nl

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Visit Sempro at Semicon Shanghai, China 

We kindly invite you to visit us at our Semicon booth in China during 16-18 March in Shanghai.

Hall W2 2769 Sempro is presenting their products together in one booth with knowledge partners

from the Advanced packaging Center (APC):

Maser technology (Reliability Test and Diagnostic services)

ALSI (laser technologies, New; multi-beam laser for low k dielectrics)

Boschman Technologies BV ( encapsulation solutions with the newest film technologies)

Nedcard (Reel solutions) Saland engineering (Testing equipment)

For any information needed pls contact us.

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Minister opens hightech Advanced Packaging Centre (APC)

Thursday, 14 January 2010

Minister Maria van der Hoeven of Economic Affairs has opened the Advanced Packaging Centre (APC)

on Monday January 11.  This was done during a visit of the Minister to Boschman Technologies in Duiven.

Minister opens hightech Advanced Packaging Centre (APC)

The APC is founded by Boschman Technologies, Nedcard, MASER Engineering and Sempro Technologies.

The APC is an initiative from the Business Cluster Semiconductors Oost-Nederland. Seventy high tech companies from especially

Twente and Nijmegen area are member of the Cluster. Minister Van der Hoeven: "This kind of initiative from medium sized enterprises

The Netherlands needs to get out of the economic crisis”!  “A good example of entrepreneurship on a regional level."

The Advanced Packaging Centre (APC) is an independent, technology & development Centre for MEMS,

Sensors and advanced IC’s packaging.

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